LRPS-2026-9204662 for TOR World Children’s Day Events 2026

UNICEF Cambodia wishes to invite eligible firms/institutions to submit a proposal LRPS-2026-9204662 for TOR World Children’s Day Events 2026 (Detail information, please read annex B TOR) SUBMISSION INSTRUCTIONS: Submission Deadline: The deadline for submission of proposals is Tuesday, 14 July 2026 by 10:00 AM Cambodia local time. Late proposal submission will not be acceptable. Required Documents: LRPS-2026-9204662 WCD 2026, page 3-5, must be completed, signed, and stamped by your company Annex D – Financial Proposal template: Must be completed, signed, and stamped by your company (in non-editable PDF format). Technical Proposal The technical and financial Proposal must be submitted in separate an email. Prices or rates shall not appear in any other part of the technical proposal Company registration/ Patent / VAT certification. Proposal Submission: Email submission: Proposals must be submitted to the ONLY ACCEPTABLE E-MAIL ADDRESS cambodia-bids@unicef.org in a non-editable format (i.e., PDF), clearly marked with the tender number (LRPS-2026-9204662), No other recipient should be "Cc" or "Bcc" in the e-mail submission. Proposals received in any other manner will be invalidated. All Bids submitted by e-mail must be submitted as email attachments. Email links (e.g., to documents to be downloaded from cloud-based folders) are not acceptable unless otherwise specifically requested. Bids submitted as a link or through a link will be invalidated. Email should not exceed 10MB. If the bid response is larger than 10MB, please zip the files or divide the response into separate files and send in multiple emails instead. Inquiries Any questions regarding this request for proposal Questions from Proposers: Proposals are required to submit any questions about this Solicitation to phnompenhsupply@unicef.org and dbou@unicef.org; no later than the close of business on 30 June 2026 (Cambodia Time). Please find the Term of reference and other support documents on the UNGM platform via