Germany – Laboratory, optical and precision equipments (excl. glasses) – Flip Chip Die Bonder
FAIR - Facility for Antiproton and Ion Research in Europe GmbH
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
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